Inspur

Inspur NF5266M5 Server

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Inspur NF5266M5 Server Overview

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Inspur NF5266M5 Server is a high density 2U storage server.

Table 1 shows the quick spec.

Model	NF5266M5
Form Factor	2U Rackmount Server
Processor	Up to 2x Intel® Xeon® Processor Scalable Family Maximum TDP: 165W Interconnection: 2x UPI interconnection links, up to 10.4GT/s per link
Chipset	Intel LBG-2 (C622)
Memory	Slots: Up to 12x DDR4 DIMM slots Type: Support RDIMM /LRDIMM, speed up to 2933MT/s Maximum Capacity: Up to 768GB (64G*12 RDIMM/LRDIMM)
Storage	Front Storage: 24x 3.5”/2.5’’ hot-swap SATA/SAS drive Rear Storage: 4x 2.5” hot-swap SATA/SAS/NVMe drive

Inspur NF5266M5 Server provides these features:

- Extreme Computing Performance with the latest generation Intel® Xeon® Scalable Processor Family

- Supports high storage capacity with 24x SATA/SAS LFF; up to 336TB with 14TB LFF drives in a 2U system

- Optimized for hybrid storage workloads with 4x NVMe SSD for data caching

- Supports 2x PCIe/SATA M.2 for boot OS

Table 2 shows the comparison.

Model	NF5466M5	NF5266M5
Specifications	4U rack-mounted server	2U Rackmount Server
Processor	Supporting 1-2 Intel ® Xeon® Scalable processors (3100, 4100, 5100, 6100, 8100 series) : with up to 28 cores (2.5GHz), maximum frequency 3.6GHz (4 cores); Two UPI interconnecting links, of 10.4GT/s maximum ; Maximum L3 level cache 1.375MB per core; Maximum thermal design power 205W	Up to 2x Intel® Xeon® Processor Scalable Family Maximum TDP: 165W Interconnection: 2x UPI interconnection links, up to 10.4GT/s per link
Chipset	Intel C622	Intel LBG-2 (C622)
Memory	Supporting up to 24* 2666MT/s RDIMM/LRDIMM/DIMMs (each processor supporting 6 memory channels and each channel supporting 2 memory slots). Supports ECC, memory mirroring and memory leveled protection..	Slots: Up to 12x DDR4 DIMM slots Type: Support RDIMM /LRDIMM, speed up to 2933MT/s Maximum Capacity: Up to 768GB (64G*12 RDIMM/LRDIMM)

Do you have any question about the NF5266M5?

Inspur NF5266M5 Server Specification
Form Factor	2U Rackmount Server
Processor	Up to 2x Intel® Xeon® Processor Scalable Family Maximum TDP: 165W Interconnection: 2x UPI interconnection links, up to 10.4GT/s per link
Chipset	Intel LBG-2 (C622)
Memory	Slots: Up to 12x DDR4 DIMM slots Type: Support RDIMM /LRDIMM, speed up to 2933MT/s Maximum Capacity: Up to 768GB (64G*12 RDIMM/LRDIMM)
Storage	Front Storage: 24x 3.5”/2.5’’ hot-swap SATA/SAS drive Rear Storage: 4x 2.5” hot-swap SATA/SAS/NVMe drive
M.2	2x 2280mm SATA/PCLe M.2
I/O expansion slot	1x PCIe Gen3 x8 OCP 2.0 mezzanine slot or PHY card (CPU0) 2x PCIe Gen3 x8 LP MD-2 (CPU0) 2x PCIe Gen3 x16 LP MD-2 (CPU1)
I/O Port	2x front USB 3.0 ports, 2x rear USB 3.0 ports 1x front VGA port, 1x rear VGA port 1x rear RJ45 IPMI port
Fan	5x hot-swappable N+1 redundant 6038 fans
Power Supply	Support 1+1 redundant power supply 1300W (Input voltage: 100V-240V AC or 192V-300V DC) Support CRPS, PMBUS, Node Manager 4.0 functions
System Management	Integrate 1x dedicated 1000Mbps network interface for IPMI2.0 remote management
Operating Environment	Operating Temperature: 10℃ -35℃ Storage & Transportation Temperature: -40℃ -60℃ Operating Humidity: 20％ -80％ relative humidity Storage & Transportation Humidity: 20％ -93％ (40℃) relative humidity
Safety Certifications	FCC, UL, CE, CB, CCC
Dimensions	System: 87.5mm (H) x 446mm (W) x 850mm (D) Package: 279mm (H) x 721mm (W) x 1168mm (D)

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